Plasma Processing PCBs - Process Technology
2019-03-29 01:35:42
Gas plasma treatment is a convenient, efficient, and high-quality method for decontamination and backside etching of printed circuit boards. Plasma treatment is particularly suitable for FR4, polyimide, and polytetrafluoroethylene (PTFE) materials because these materials have poor chemical activity. The plasma treatment is more active. The plasma technique is established by separating the process gas under vacuum conditions using energy from the electric field via a high frequency generator (typically 40 KHz). These excited unstable gas separation materials modify the surface and bombard it. Treatment processes such as fine UV cleaning, activation, consumption and cross-linking, and plasma polymerization are the plasma surface treatments.
[Advantages of plasma treatment process are] 1. Process technology can be controlled 2. Environmental protection process 3. Low-cost processing process 4. No treatment waste cost 5. Drying treatment [Plasma processing workpiece principle] Plasma is from ultraviolet ray The product of light is that following the solid, liquid, and gas, the plasma is the fourth state of matter. Plasma has ions, free electrons, photons, neutrons, atoms, molecules, etc. excite electronic states. Each component has the ability to handle the surface. With a high pressure to ground, 40 KHz and 13.58 MHz high frequency generators make the gas plasma. The 2.54 GHz microwave system is the third device to establish a plasma state. The above three different frequency high frequency generators have slightly different adaptability in application. The activated atoms, molecules, ions and free electrons are highly concentrated and can act on the solid surface in the plasma state, causing chemical and physical modification of the material surface. Plasma surface treatment has the following effects: cleansing; activating; ablation; cross-linking.
[Cleaning] Cleaning work is to remove weak bonds to use typical -CH-based organic contaminants. The main characteristic is that it only acts on the surface and does not erode the internal effects. It has an ultra-high cleaning surface and is ready for the next process.
[Activation Activation] Activation is the formation of three groups on the surface of the carbonyl Carboxyl carboxyl Hydroxyl hydroxyl group. This group has a stable function that has a positive effect on bonding hydrophilicity instead of a weak bond. The main increase is the surface energy. For polymers, poor adhesion results due to low surface energy.
Crosslinking Cross-linking is performed in an inert atmosphere. The keys are broken and recombined to form a double or triple bond or a bond that forms a combination of free radicals and another bond.
Ablation Ablation removes polymer chains and weak bonds when it bombards the polymer surface. This facilitates decontamination and backside etching of printed circuit boards. The above three effects are a combination of the interactions of the plasma surface treatment phases. Proper and reasonable choice of process parameters and gas mixture ratio can get the best results.
[Process parameters] In the plasma treatment, the following process parameters are reasonably selected to play a very important role in the gas type and mixing ratio; power; processing time; studio pressure; gas flow.
Gas Mixing Oxygen is the most commonly used gas for cleaning and activating polymer surfaces and other surfaces. Inert gases such as ammonia act as cross-links. Other gases such as CF4 are more active. The mixing of different gases can be optimized. [Gas Flow] According to the studio volume, vacuum system and working pressure determine the gas flow rate, especially the working pressure and gas flow are more closely related.
[Working Pressure] The plasma treatment is stable within a certain working pressure range. Too low or too high working pressure leads to unstable plasma processing. High frequency generators cannot meet system requirements and plasma processing will be unstable. For RF systems, working pressure is best between 100-300 torr. Low working pressure leads to longer life of activated substances. Higher working pressures can result in higher gas utilization. So it must be optimized.
[Process time] Longer processing time Generally speaking, deeper decontamination and etching of printed circuit boards can be achieved. In some cases, excessive repairs may result in excessive treatment or heat damage.
[Power] High power can shorten the processing time. Due to the high power, the activated substances are more lively. The power plays an important role in the generation of heat. It's not that the higher the power, the better.
ã€Precautions】
High power and long processing time affect the temperature in the work chamber. Too high work pressure also reduces the efficiency of plasma processing.
ã€application】
According to different processing materials, select the process parameters. Different types of plasma processing equipment, such as CD 600PC and CD-1000PC, have different working volumes; the process parameters are different. Corresponding process parameters are provided at random. Special material handling requires some fine tuning of process parameters.
[Treatment of FR4 Printed Circuit Boards]
For desmear and backside etching of printed circuit boards, isotropic FR4 printed circuit boards. Etching can be done with a mixture of CF4 and oxygen. The following four steps are used to perform the 1) heating process: 20 minutes, using oxygen, power 3000W, warming up to 70°C; 2) decontamination backwashing 20 minutes, O2/CF4 (85/15 to 90/10% mixing) Power 3000W; 3) Cleaning/activation process 5 minutes O2 power 3000W; 4) N2 inlet process to exclude remaining CF4 gas Etching gas is a mixture of CF4 and oxygen. Increasing the CF4 gas can increase the etching rate. The disadvantage is that some parts of the plasma processing equipment (such as O-rings) must be damaged. Therefore, the ratio of gas to be controlled should be 10-15%. Temperature is a very important parameter, so the heating process needs to be set specifically during the ion treatment. The plasma device can measure the temperature and automatically switch the next process when the temperature is reached. The temperature setting is controlled by the computer. High temperatures result in higher etch rates, typically temperatures of 60°C-80°C. Higher temperatures damage printed circuit boards, especially thin printed circuit boards. The cleaning activation process is necessary in order to intensify the surface of the printed circuit board because the surface water repellency can be obtained by CF4 gas treatment.
[Polyimide Kapton Printed Circuit Board Processing]
The flexible printed circuit board made of polyimide can be processed by plasma regardless of adhesive. The same process parameters can be applied to DuPont Kapton materials.
[Teflon printed circuit board through-hole processing. 】
Polytetrafluroene PTFE is an inert material that is processed to activate PTFE surfaces with an activation level of 45-50 dyne. Due to the limited shelf life, it is required that the material surface metal processing be performed immediately within the same day. The processing technology is mainly NH or He-O2. The chemical reaction started with very active NH2 gas. The disadvantage of ammonia is the odor and the need for special MFC controllers. The parameters used for the CD-1000 PCB plasma processing equipment are as follows. 1. Heat power 2500 W with N2 or inert gas (without O2) for 10 minutes until the temperature is 70°C. 2. Enter O2/He (50/50% mixture) for 10 minutes at 2000W. 3. Enter 100% He for 5 minutes and power 2000W. The heating process is very demanding for some very thin printed circuit boards and this process can be eliminated or reduced. For the machine, the gas flow is controllable but the process pressure must be about 250-300 Torr. The treated surface is active and no further processing is required before metallization.
ã€in conclusion】
EUROPLASMA's plasma equipment can provide micro-adjustment of process parameters in order to optimize the surface treatment of different materials. Practice has proved that the use of plasma surface treatment of multilayer soft or soft and hard materials, can get a good quality printed circuit board.
[Advantages of plasma treatment process are] 1. Process technology can be controlled 2. Environmental protection process 3. Low-cost processing process 4. No treatment waste cost 5. Drying treatment [Plasma processing workpiece principle] Plasma is from ultraviolet ray The product of light is that following the solid, liquid, and gas, the plasma is the fourth state of matter. Plasma has ions, free electrons, photons, neutrons, atoms, molecules, etc. excite electronic states. Each component has the ability to handle the surface. With a high pressure to ground, 40 KHz and 13.58 MHz high frequency generators make the gas plasma. The 2.54 GHz microwave system is the third device to establish a plasma state. The above three different frequency high frequency generators have slightly different adaptability in application. The activated atoms, molecules, ions and free electrons are highly concentrated and can act on the solid surface in the plasma state, causing chemical and physical modification of the material surface. Plasma surface treatment has the following effects: cleansing; activating; ablation; cross-linking.
[Cleaning] Cleaning work is to remove weak bonds to use typical -CH-based organic contaminants. The main characteristic is that it only acts on the surface and does not erode the internal effects. It has an ultra-high cleaning surface and is ready for the next process.
[Activation Activation] Activation is the formation of three groups on the surface of the carbonyl Carboxyl carboxyl Hydroxyl hydroxyl group. This group has a stable function that has a positive effect on bonding hydrophilicity instead of a weak bond. The main increase is the surface energy. For polymers, poor adhesion results due to low surface energy.
Crosslinking Cross-linking is performed in an inert atmosphere. The keys are broken and recombined to form a double or triple bond or a bond that forms a combination of free radicals and another bond.
Ablation Ablation removes polymer chains and weak bonds when it bombards the polymer surface. This facilitates decontamination and backside etching of printed circuit boards. The above three effects are a combination of the interactions of the plasma surface treatment phases. Proper and reasonable choice of process parameters and gas mixture ratio can get the best results.
[Process parameters] In the plasma treatment, the following process parameters are reasonably selected to play a very important role in the gas type and mixing ratio; power; processing time; studio pressure; gas flow.
Gas Mixing Oxygen is the most commonly used gas for cleaning and activating polymer surfaces and other surfaces. Inert gases such as ammonia act as cross-links. Other gases such as CF4 are more active. The mixing of different gases can be optimized. [Gas Flow] According to the studio volume, vacuum system and working pressure determine the gas flow rate, especially the working pressure and gas flow are more closely related.
[Working Pressure] The plasma treatment is stable within a certain working pressure range. Too low or too high working pressure leads to unstable plasma processing. High frequency generators cannot meet system requirements and plasma processing will be unstable. For RF systems, working pressure is best between 100-300 torr. Low working pressure leads to longer life of activated substances. Higher working pressures can result in higher gas utilization. So it must be optimized.
[Process time] Longer processing time Generally speaking, deeper decontamination and etching of printed circuit boards can be achieved. In some cases, excessive repairs may result in excessive treatment or heat damage.
[Power] High power can shorten the processing time. Due to the high power, the activated substances are more lively. The power plays an important role in the generation of heat. It's not that the higher the power, the better.
ã€Precautions】
High power and long processing time affect the temperature in the work chamber. Too high work pressure also reduces the efficiency of plasma processing.
ã€application】
According to different processing materials, select the process parameters. Different types of plasma processing equipment, such as CD 600PC and CD-1000PC, have different working volumes; the process parameters are different. Corresponding process parameters are provided at random. Special material handling requires some fine tuning of process parameters.
[Treatment of FR4 Printed Circuit Boards]
For desmear and backside etching of printed circuit boards, isotropic FR4 printed circuit boards. Etching can be done with a mixture of CF4 and oxygen. The following four steps are used to perform the 1) heating process: 20 minutes, using oxygen, power 3000W, warming up to 70°C; 2) decontamination backwashing 20 minutes, O2/CF4 (85/15 to 90/10% mixing) Power 3000W; 3) Cleaning/activation process 5 minutes O2 power 3000W; 4) N2 inlet process to exclude remaining CF4 gas Etching gas is a mixture of CF4 and oxygen. Increasing the CF4 gas can increase the etching rate. The disadvantage is that some parts of the plasma processing equipment (such as O-rings) must be damaged. Therefore, the ratio of gas to be controlled should be 10-15%. Temperature is a very important parameter, so the heating process needs to be set specifically during the ion treatment. The plasma device can measure the temperature and automatically switch the next process when the temperature is reached. The temperature setting is controlled by the computer. High temperatures result in higher etch rates, typically temperatures of 60°C-80°C. Higher temperatures damage printed circuit boards, especially thin printed circuit boards. The cleaning activation process is necessary in order to intensify the surface of the printed circuit board because the surface water repellency can be obtained by CF4 gas treatment.
[Polyimide Kapton Printed Circuit Board Processing]
The flexible printed circuit board made of polyimide can be processed by plasma regardless of adhesive. The same process parameters can be applied to DuPont Kapton materials.
[Teflon printed circuit board through-hole processing. 】
Polytetrafluroene PTFE is an inert material that is processed to activate PTFE surfaces with an activation level of 45-50 dyne. Due to the limited shelf life, it is required that the material surface metal processing be performed immediately within the same day. The processing technology is mainly NH or He-O2. The chemical reaction started with very active NH2 gas. The disadvantage of ammonia is the odor and the need for special MFC controllers. The parameters used for the CD-1000 PCB plasma processing equipment are as follows. 1. Heat power 2500 W with N2 or inert gas (without O2) for 10 minutes until the temperature is 70°C. 2. Enter O2/He (50/50% mixture) for 10 minutes at 2000W. 3. Enter 100% He for 5 minutes and power 2000W. The heating process is very demanding for some very thin printed circuit boards and this process can be eliminated or reduced. For the machine, the gas flow is controllable but the process pressure must be about 250-300 Torr. The treated surface is active and no further processing is required before metallization.
ã€in conclusion】
EUROPLASMA's plasma equipment can provide micro-adjustment of process parameters in order to optimize the surface treatment of different materials. Practice has proved that the use of plasma surface treatment of multilayer soft or soft and hard materials, can get a good quality printed circuit board.
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