A method for overcoming the large water absorption rate of particleboard
Since the particle board is made of wood material or other plant fiber raw materials such as bagasse, the molecular structure of cellulose, hemicellulose, lignin and the like in the chemical constituents of these raw materials contain hydroxyl groups of hydrophilic groups, which leads to natural wood. It has the ability to absorb water and absorb moisture. When the vapor pressure of the air is greater than the vapor pressure of the moisture on the surface of the wood, it can absorb moisture, and when it is less than the vapor pressure of the surface moisture of the wood material, the moisture of the wood material will evaporate outwardly and discharge the water. Because particleboard is made up of countless small wood or other plant materials, when pressed into particleboard, their structure is relatively loose, especially the core material, there is a large gap, and contact with air or water, it forms a The capillary phenomenon continuously absorbs water, which is a bad property of the particle board, which is a major defect that causes the particle board to expand, deform and crack, and further shortens its service life.
In order to overcome the above drawbacks, a certain amount of adhesive such as urea-formaldehyde resin glue or the like is applied during the production process. In addition to increasing the bonding strength between the shavings or the scraps, these adhesives can also fill a part of the voids in the form of particles, which hinders the channels for moisture absorption and water absorption. In addition, paraffin waterproofing agent is added in the production, which is a hydrophobic substance, which adds water-proof effect to the particle board after being added.
In addition, the surface of the particle board can be finished, veneered or edge-sealed, and the effect of moisture absorption and water absorption of the particle board can be prevented.
Guangzhou Ruixin Touch Control Technology Co., Ltd. , https://www.weetaach.com